Monday, February 20, 2017

Nikkei on Sony 3-Layer Stacked Sensor

Nikkei overviews Sony ISSCC 2017 paper on the 960fps 3-layer stacked sensor:

Sunday, February 19, 2017

LeEco Spent 540 Days Adjusting its Smartphone Camera Performance

One of the large Chinese consumer electronics companies, LeEco, says it has spent more than 540 days tuning its new Le Max 2 smartphone camera performance:

Friday, February 17, 2017

MIPI C-PHY Tutorials

MIPI Alliance posted a number of interesting videos from MIPI DEvcon in Sept. 2016. Among them, there is a C-PHY tutorial by Mohamed Hafed, Introspect Technology:

Another C-PHY tutorial comes from George Wiley, Qualcomm:

Dual Camera Phones to Boost LG Innotek, SEMCO Revenues

The Korea Herald: Samsung Electro-Mechanics (SEMCO) and LG Innotek’s profits are growing on rising demand for dual camera phones, according to the newspaper's sources. SEMCO is supplying its dual cameras to Chinese Xiaomi and LeEco since Q3 2016 and it is also in talks with Huawei, Oppo and Vivo.

According to Counterpoint analysts, the sales of smartphones with dual cameras will rise more than 400% YoY to reach 300 million units in 2017.

DALSA Works on DBI-Stacked Sensors

BusinessWire: Invensas, a wholly owned subsidiary of Tessera, announces that Teledyne DALSA has signed a technology transfer and license agreement for Direct Bond Interconnect (DBI) technology.

DBI technology is a key enabler for true 3D-integrated MEMS and image sensor solutions,” said Edwin Roks, president of Teledyne DALSA. “We are excited about the prospect of developing new products and providing new foundry services to our customers that utilize this technology. By working closely with Invensas, we will be able to move more quickly to deploy this capability efficiently and effectively.

We are pleased that Teledyne DALSA, a recognized leader in digital imaging products and MEMS solutions, has chosen our DBI technology to accelerate the development and commercialization of their next generation MEMS and image sensor products,” said Craig Mitchell, President of Invensas.

Thursday, February 16, 2017

Global and China Imaging Industry Report, 2016-2020

ResearchInChina publishes "Global and China CMOS Camera System Industry Report, 2016-2020." Few quotes:

"In 2016, the CIS (CMOS Image Sensor) market size approximated USD10.516 billion, rising by 5.6% from a year ago, but with an obvious fall in the speed of growth compared with the growth rate of 13.5% in 2015, mainly because medium- and high-end products are monopolized by Sony and the manufacturers in low- and medium-end fields are hard to break through the technological barriers and do nothing but hit the price war even in the vehicle field.

Although influenced by factors like the Earthquake and the Appreciation of Japanese Yen, Sony still monopolized the medium- and high-end fields by dint of its overwhelming performance superiority and saw an upsurge of 32.9% in its revenue in 2016; by contrast, other players excluding Panasonic and Hynix saw decline. It is expected that, in 2017, the CIS market will grow 4.0%, Sony will see a growth rate of at least 10%, and most others will continue to suffer losses. In spite of being not much expected, the mobile phone market is still the most important market and Sony still monopolizes the high-end mobile phone market.

In 2015, the global CCM (CMOS Camera Module) market size reported USD16.611 billion, up 3.8% from a year earlier but the lowest growth rate since 2010. In 2016, as the shipment of Apple phones with the highest single price of CCM fell, the world CCM market was at low ebb and down 0.5%. Due to the dual-camera stimulus in 2017, the global market rebounds substantially with the growth rate of 4.3% and the size estimated to be USD17.232 billion in 2017 and USD18.512 billion in 2020.

In 2016, Chinese manufacturers made remarkable achievements, while South Korean counterparts saw a drop or slight rise in revenue due to their heavy reliance on Apple and Samsung. Among Chinese players, Q-Tech enjoys the highest growth rate up to 84.5%, followed by Truly, both of which benefited from the outstanding performance of big customers OPPO and VIVO.

It is anticipated that monochrome dual-camera with same pixel will be the mainstream for smart phone brands except Apple in the future, as it is more affordable and can improve nightscape significantly (visible effect betterment for consumers), while Apple will persist in duel-camera design enriching depth of focus. Smart phones tend to be highly homogenized. Although they are still not quite satisfied with the dual-cameras, consumers are more impressed with dual-cameras than mono-camera. So, dual-camera is expected to be a standard configuration in high-end smart phones, and the penetration rate till 2020 would be as high up to 30-40%.

Sony Unveils 4 New GS Sensors

Sony presents 4 new GS CMOS sensors for industrial applications. The sensors have 1/2.9-inch format and include 1.58MP IMX273LLR/LQR and IMX296LLR, and 0.4MP large pixel IMX287LLR/LQR and IMX297LLR.

Sony also posts a video demo of GS sensor advantages:

Wednesday, February 15, 2017

Yole on Medical Imaging Market

Yole Développement says that the solid-state medical imaging including CCD, CIS, a-Si FPD, a-Se FPD, and SiPM are step by step penetrating the medical imaging industry. Yole’s analysts estimate the solid state medical imaging device market at US$350 million in 2016 with a comfortable 8.3% CAGR until 2022.

For some technologies and applications, wafer volume growth is very significant,” explains Yole’s Activity Leader, Pierre Cambou. “For example, the development of SiPM7 in the field of molecular imaging will multiply in quantity by more than 6x over the next five years. This massive transformation from photomultiplier tubes to solid-state IC was derived from the need of multimodal equipment (PET/MRI10) but it’s going to have a direct consequence in the field of PET/CT11 and spread all the way to SPECT12 imaging."

Basler ToF Camera Promotional Video

Basler presents a video of its ToF camera features and applications. Basler calls it "the first high-resolution Time-of-Flight Camera in the mid-ranged price segment to offer such a broad variety of powerful Machine Vision features."

Corephotonics Announces Collaboration with Samsung Electro-Mechanics

Corephotonics has partnered with Samsung Electro-Mechanics (SEMCO) to develop a complete camera module reference design, based on Corephotonics dual camera technology. Through this reference design, which is now in volume production, smartphone manufacturers get 5.5mm-slim dual camera designs with 3x optical zoom capability.

The camera has become a key differentiator in the current, highly competitive global smartphone market. Via the dual camera zoom solution pioneered by Corephotonics and the access we have now gained to their technology, it is possible to greatly expand upon our current smartphone camera capabilities,” states EVP Hong, CMO of SEMCO. “This will take us closer than ever before to the imaging performance that would normally be associated with an SLR.

SEMCO is an acknowledged leader in smartphone camera modules and it is now fully equipped with a broad range of Corephotonics technology,” adds Eran Briman, VP of Marketing & Business Development at Corephotonics. “By integrating our calibration tools into its production lines, SEMCO is now better positioned for delivering mass production zoom dual camera modules which are drop-test certified and support relaxed calibration assembly. Combining such modules with Corephotonics’ zoom and bokeh algorithms easily satisfies consumer demands for elevated imaging functionality.