Sunday, June 14, 2015

Harvest Imaging Forum Agenda Published

Albert Theuwissen publishes a tentative agenda of this year's forum "3D Imaging with Time-of-Flight: Solid-State Devices, Circuits and Architectures" delivered by David Stoppa:

Introduction
  • Applications for 3D image sensors
  • Range sensing technologies: taxonomy, pros and cons
  • Active range sensors (Triangulation, Interferometry and Time-of-Flight): operation principle and solid-state implementation
  • Time-of-Flight measurement principle and implementations
Time-of-Flight System
  • Building blocks
  • Optical power budget and system design considerations
  • Technical requirements for 3D Time-of-Flight image sensors
  • History and evolution of 3D image sensors versus 2D
Detector Technologies: Photo-demodulators (PDM), Electronic Shutter (ES), SPADs and APDs
  • Evolution of PDM-devices from CCD to CIS
  • Description and analysis of State-of-the-art PDM implementations
  • Description and analysis of SoA ES solutions
  • From photodiode to SPAD through APDs
  • SPAD operation principle and behavioural model
  • SPAD front-end and processing electronics
  • Description and analysis of SoA SPAD-based solutions
  • Pros and cons of each detector technology and best application scenarios
3D Image sensors readout architectures and main processing blocks
  • Sensor architectures, column amplifiers, ADCs, on-chip processing blocks
  • Extra electronics needed by 3D Time-of-Flight with respect to 2D (TDCs, TACs, drivers)
Main noise sources in 3D imagers
  • Noise analysis and case study for PDM, ES and SPAD sensors
3D Image sensors characterisation and Figures of Merit
  • How to test a 3D Time-of-Flight imager
  • Main Figures of Merit
Additional topics
  • Best 3D sensor technology for your application
  • System aspects and trade-offs
  • Future perspective and roadmap
Wrap-up

3 comments:

  1. I can hardly think of a better person to give such a short course than David Stoppa. Hope the forum is full! (and I am not related to this forum in any way).

    ReplyDelete
  2. Thanks Eric for your kind words.
    First session is almost filled, second session still has seats available.

    ReplyDelete
  3. Thanks Eric, I feel even more now the pressure of responsibility ;-)

    By the way, I know that several TOF experts from the main players in 3D imaging will attend the Forum so I definitely expect a lot of interesting discussions during the two-days course!

    ReplyDelete

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